the demand for computing performance in the ipc market continues to become stronger as the it field advances. acrosser’s new has been designed to meet these demands.
the f.i.t. technology used to build this new product reflects its 3 major features: fanless design, intel core i processor and ultra thin frame. the fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. with a height of less than 0.8 inches, aes-hm76z1fl’s slim design makes itself fit into every application.
as its structure and output interface show, aes-hm76z1fl provides a wide range of choices, from hdmi, vga, usb, and audio to gpio output interfaces that suit almost all industries. for wireless communication needs, the aes-hm76z1fl has a mini-pcle expansion slot which provides support on both 3.5g and wifi.
another fascinating feature of the aes-hm76z1fl is its ease of installation for expansions. by disassembling the bottom cover, expansions such as cf cards, memory upgrades and mini-pcie can be easily complete without moving the heat sink. moreover, acrosser adopts 4 types of cpu (intel core i7/i3, intel celeron 1047ue/927ue) for aes-hm76z1fl, allowing it to satisfy the scalable market demands of different applications.
in conclusion, the aes-hm76z1fl is truly a well-rounded product designed for diverse applications. to promote our star product aes-hm76z1fl, acrosser will launch a product testing campaign starting in january, 2014. acrosser will provide selected applications with the new aes-hm76z1fl for one month, and it’s free! for more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at !